Note: The job is a remote job and is open to candidates in USA. Nokia is a global leader in connectivity for the AI era. As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules, integrating Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines.

Responsibilities

• Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met
• Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets
• Drive key technology development to enable next generation product design
• Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software
• Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses
• Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products
• Plan and Drive prototype assembly builds to enable deliveries for early design validation
• Drive package debug activities during product validation and qualification
• Survey new materials and vendors for all Advanced Packaging activities
• Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers

Skills

• Advanced Degree in Mechanical Engineering or similar field
• 5-8 years of extended experience in high-volume packaging of 2.5/3D packages
• Expertise in next generation advanced photonics packaging technologies
• Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software
• Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software
• Experience with package and process design/development from design to production
• Expertise in material properties and yield/failure mode analysis
• Experience with documentation of fabrication, inspection, and assembly processes
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging
• Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis
• Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc
• Experience in optical coupling design and assembly for optical engines
• Experience in multilayer material bonding and heterogeneous integration
• Experience in high-speed signal integrity design and analysis

Benefits

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

Company Overview

Company H1B Sponsorship