Note: The job is a remote job and is open to candidates in USA. TYLsemi, Inc. builds chiplet infrastructure IP for AI and HPC systems. The Staff Thermal & Thermo-Mechanical Analysis Engineer leads thermal modeling, thermo-mechanical simulation, and cooling-solution development for AI data center hardware across chip, package, PCB, and system levels.

Responsibilities

• Thermal Analysis & Modeling: Build high-fidelity static and dynamic thermal models for AI workloads spanning silicon, advanced packaging, and system levels
• Thermo-Mechanical Simulation: Predict and mitigate structural risks including warpage, die-tilt, thermal stress, and solder joint reliability (BLR/BGA)
• Workload-Driven Characterization: Simulate transient thermal behavior under varying data center workloads, calculating time-dependent nodal temperatures, and plotting thermal contours
• Mitigation Strategies: Develop, propose, and implement innovative cooling and mechanical mitigation techniques (e.g., TIM selection, stiffener rings, optimized copper balancing)
• System level solution: Perform thermal modeling and CFD analysis for die, package, board, and system designs. Develop cooling solutions for high-power AI/HPC devices (>1kW TDP)
• Cross-Functional Collaboration: Partner with Silicon Architecture, Package Design, and System Hardware teams to co-optimize the thermal-mechanical-electrical envelope. Engage with ODMs and cooling ecosystem partners

Skills

• 5+ years of industry experience in thermal and structural analysis of semiconductor packages and systems
• Proficient in industry-standard thermal and thermo-mechanical tools, specifically Ansys Icepak and Cadence Celsius
• Fluent, Star-CCM+, FLOEFD, RedHawk-SC ET
• Proven experience modeling high-density packaging architectures, specifically TSMC CoWoS-L (with Silicon Interposers)
• Deep understanding of complex package substrates and heavy data center-class PCBs
• Hands-on experience analyzing high-power GPU workloads (700W–1000W+) under both static steady-state and dynamic transient states
• Ability to extract, analyze, and present complex simulation metrics, including multi-layer thermal contours and structural warpage profiles
• Hands-on experience designing physical package layouts and substrate routing using Cadence APD (Allegro Package Designer) or Allegro X
• Familiarity with structural analysis tools like Ansys Mechanical for deep-dive finite element analysis (FEA)

Benefits

• Remote-friendly; US team is Bay Area preferred, but hires the best people regardless of location.

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