Position: TPM - Physical Design Location : Remote Job Type: Contract W2

Summary

The Technical Program Manager (TPM) – Advanced SoC Physical Design is responsible for leading end-to-end execution of complex SoC implementation programs from RTL handoff through GDSII signoff. The role combines deep technical expertise in advanced-node Physical Design with strong program leadership, customer engagement, risk management, and cross-functional coordination across Design, Verification, DFT, Package, CAD, and Silicon Validation teams. The TPM serves as the single point of accountability for delivery predictability, schedule adherence, quality, customer communication, and successful tape-out execution. The ideal candidate possesses strong full-chip implementation experience across advanced process technologies and has demonstrated success driving large-scale ASIC/SoC programs to production. Required B.E./B.Tech/M.E./M.Tech in Electronics, Electrical Engineering, Computer Engineering, or related field. 10–18+ years of semiconductor industry experience. Minimum 5+ years leading SoC implementation programs or full-chip tape-outs. Proven experience managing customer-facing engagements and large delivery teams. Track record of successful silicon tape-outs at advanced process nodes. Preferred Experience managing multi-site/global development teams. Exposure to HPC, AI/ML, Data Center, Networking, Mobile, or Automotive SoCs. PMP, PgMP, Agile, or equivalent program management certification. Experience with AI-assisted design methodologies and EDA automation.